Thermal Stress Intensity Factors for Two Coplanar Cracks in a Piezoelectric Strip
نویسندگان
چکیده
منابع مشابه
Multiple moving cracks in an orthotropic strip sandwiched between two piezoelectric layers
In this paper, the solution of a moving Volterra-type screw dislocation in an orthotropic layer, bonded between two piezoelectric layers is obtained using complex Fourier transform. The dislocation solution is then employed as strain nuclei to derive singular integral equations for a medium weakened by multiple moving cracks. These equations, which are classified as, Cauchy singular equations, ...
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Three-dimensional enriched finite elements are used to compute mixed-mode stress intensity factors (SIFs) for three-dimensional cracks in elastic functionally graded materials (FGMs) that are subject to general mixed-mode loading. The method, which advantageously does not require special mesh configuration/modifications and post-processing of finite element results, is an enhancement of previou...
متن کاملmultiple moving cracks in an orthotropic strip sandwiched between two piezoelectric layers
in this paper, the solution of a moving volterra-type screw dislocation in an orthotropic layer, bonded between two piezoelectric layers is obtained using complex fourier transform. the dislocation solution is then employed as strain nuclei to derive singular integral equations for a medium weakened by multiple moving cracks. these equations, which are classified as, cauchy singular equations, ...
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Dynamic fracture mechanics of layered materials has been gaining lots of attentions among the researchers where the layered materials are extensively used in various products and devices to improve structural performance such as strength and durability. The influence of the crack moving speed on the the stress intensity factors was a popular subject in classical elastodynamics. Among the models...
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A crack of arbitrary size and orientation near bimaterial interfaces between dissimilar thermopiezoelectric materials is considered . A system of singular integral equations for the unknown thermal analog of dislocation density defined on the crack faces is derived by way of the Stroh's formulation and the thermoelectroelastic Green's fUflctions developed recently. The stress and electric displ...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 2007
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.73.1410